The form and composition of solders used in electronics has undergone many changes throughout the history of electronics. The solder form has changed from wires and ingots to pastes, while the composition has changed from 50Sn/50Pb to eutectic 63Sn/36Pb and a range of intermediate compositions. Today, electronics needs a reliable process that can deposit solder films with a suitable lead–free composition and form solders bumps up to 10’s of micron size upon reflow. Amongst the various options, Sn and its binary and ternary alloys with Cu, Ag, Bi and In are amongst the contenders for the coveted lead-free solder slot. This new book presents and discusses the innovations being made in electroplating of lead free solder for electronics.